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BiSn solder reflow profile3/19/2024 Applying the 13-degree guideline to the SnCuNi alloy results in a minimum peak temperature recommendation of 240☌. Recommended reflow temperatures are typically at least 13☌ higher than melting temperatures hence the SAC305 peak temperature window of 233 – 255. SAC305 begins to melt at 217☌, reaching its fully liquid state at approximately 220.6☌. Fear of full compatibility with SAC reflow processes. Why has it not gained major acceptance as an SMT alloy? In large part, fear. Because it contains no silver, it is much more economical than SAC alloys containing 1, 3 or even 4 percent of the precious metal, and it produces smooth, shiny, easy-to-inspect solder joints. Nickel-modified tin-copper solder, known commercially as SN100C®, is a leading lead-free alloy for PTH soldering, rework and hot air leveled PCB final finishes. If you have any questions about bridging or anything else, please contact our technical support team.Sn/Cu/Ni soldering performance at low temperatures. We hope this helps resolve your bridging issues. Try ensuring that the components are properly aligned, adjusting the reflow profile and cleaning the pads. This can be caused by a number of factors including misaligned components, incorrect reflow profile, or contaminated pads. Try reducing the amount of solder paste and adjusting the reflow profile. This is often caused by too much solder paste or incorrect reflow profile. Try reducing the amount of solder paste, ensuring that the components are properly aligned, and adjusting the reflow profile. This can be caused by a number of factors, including too much solder paste, misaligned components, or incorrect reflow profile. Here are some additional tips for other more specific solder bridging issues: Make sure that the pads are clean and free of any contaminants before assembling the PCB. Use a reflow profile that is optimized for the solder paste you are using and the components you are assembling. Make sure to use a correct reflow profile A higher viscosity solder paste will be less prone to bridging. Select a solder paste with the correct viscosity for your application. This will help to ensure that the components are properly aligned and seated. Use a pick-and-place machine to place the components on the PCB. This will help to ensure that the correct amount of paste is applied and that the paste is evenly distributed. Use a stencil to apply the solder paste to the pads. There are a number of things you can do to prevent solder bridging: It can help if the pads are clean and free of any contaminants. Make sure that the reflow profile is correct for the solder paste you are using and the components you are assembling. It is important that the solder paste you are using has the correct viscosity for your application. Make sure that the solder paste is being applied correctly and that the amount of paste is not excessive.Įnsure that all of the components are properly aligned and seated. If you are having problems with solder bridging, there are a number of things you can try to troubleshoot the issue: Some helpful example of how to fix some issues in solder bridging: If the components are misaligned during placement, it can create gaps between the pads and the components which can then be filled with solder and will then create bridges. If too much solder paste is applied to the pads, it can increase the chances of bridging. If the pads are contaminated with dirt, oil, or other substances, it can prevent the solder from adhering properly, which can lead to bridging. If the reflow profile is not correct, it can cause the solder to flow excessively, increasing the chances of bridging. Solder paste with the wrong viscosity can be more prone to bridging. There are a number of factors that can possibly contribute to solder bridging including: Here are a few pictures of soldering connecting or in most cases misconnecting two or more adjacent pads that come into contact to form a conductive path. Solder bridges occur more often these days as printed circuit boards have grown smaller over time.īelow are some reasons why you might be getting soldering bridges and some tips on how to fix them. It generally occurs when there is accidental connection of solder that is formed between two pads, pins or even traces that typically form a conductive path. Solder bridging is a common occurrence or mistake (defect) that can occur during the Surface Mount Technology (SMT) assembly process.
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